Hot Air Solder Leveling
Hot Air Solder Leveling (HASL) is a widely used surface finish in PCB manufacturing.
It involves coating the exposed copper surfaces of a PCB with
a layer of solder to protect them from oxidation and facilitate the soldering process during assembly.
The solder-coated surface provides a flat,
even surface for component attachment and ensures good solderability.
In the world of printed circuit board (PCB) manufacturing,
selecting the right surface finish is crucial for ensuring reliable connections,
optimal solderability, and overall performance.
Among the various surface finishes available, two common options are HASL (Hot Air Solder Leveling)
and LF-HASL (Lead-Free Hot Air Solder Leveling).
These surface finishes play a significant role in protecting the copper traces on PCBs and facilitating the soldering process during assembly.
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Join us as we delve into the world of HASL and LF-HASL surface finishes, unraveling the intricacies that contribute to the reliability and performance of modern printed circuit boards.
The Process of Applying HASL to PCBs