UHDI PCBs can be either rigid or flexible and are often multilayered to handle the density of interconnects. As electronics continue to shrink,
so does the printed circuit board, not only in the X-axis but also the Y-axis. Although multilayering is essential to maintaining signal integrity and minimizing electromagnetic interference
in UHDI PCBs, PCB designers use fine-line routing that enables consolidation of traces into smaller layer count, which reduces the number
of HDI buildup layers. Eliminating HDI buildup layers can greatly reduce the costs required to fabricate the PCB,
which further enables offsetting some of the additional costs required to access ultra-HDI fabrication capabilities.
High-performance substrates like Ajinomoto build-up film (ABF), BT epoxy-based materials, thin liquid crystal polymer
(e.g., UltraLam) and resin-coated copper films (metalized polyimide, pure polyimide, cast polyimide) are used as alternatives to laser-drillable materials and thin reinforced FR4.
These may be used in combinations to create an ultra-HDI build. One such combination is the use of BT epoxy-based laminates as a core with conventional buried
vias and ABF as the outer buildup layers that support fine-line routing. This buildup style is used as an organic substrate in BGA packaging, but the same approach can be used for an ultra-HDI PCB.
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